creat by art - glass passivated junction - ideal for printed circuit board - typical ir less than 0.1 a - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a i 2 ta 2 s r jc o c/w t j o c t stg o c document number: ds_d1312003 version: h13 ts8p01g thru ts8p07g taiwan semiconductor glass passivated brid g e rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec ts-6p mechanical data case: ts-6p polarity: polarity as marked on the body mounting torque: 8.17 in-lbs maximum weight: 7.15 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol ts8p 01g ts8p 02g ts8p 03g ts8p 04g ts8p 05g ts8p 06g ts8p 07g unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage v maximum average forward rectified current 8 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 200 a 1.4 rating for fusing (t<8.3ms) 166 maximum instantaneous forward voltage (note 1) @ 4 a @ 8 a v f 1.0 1.1 operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle maximum dc reverse current t j =25 at rated dc blocking voltage t j =125 i r 10 500 a typical thermal resistance
part no. part no. ts8p07g ts8p07g (ta=25 unless otherwise noted) document number: ds_d1312003 version: h13 green compound ts8p07g c2g c2 g ratings and characteristics curves ordering information packing 15 / tube forming 15 / tube (auto) preferred p/n packing code green compound code ts8p07g c2 c2 description note 1: "x" defines voltage from 50v (ts8p01g) to 1000v (ts8p07g) example ts8p0xg (note 1) c2 suffix "g" ts-6p x0 ts-6p d2 ts-6p ts8p01g thru ts8p07g taiwan semiconductor packing code green compound code package 0 2 4 6 8 10 0 50 100 150 average forward a current (a) case temperature ( o c) fig.1- maximum forward current derating curve resistive or inductive load with heatsink 0 50 100 150 200 250 1 10 100 peak forward surge current (a) number of cycles at 60hz fig.3- maximum non-repetitive forward surge current 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2- typical reverse characteristics tj=25 tj=125 0.1 1 10 100 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 instantaneous forward current (a) forward voltage (v) fig. 4- typical forward characteristics pulse width=300 s 1% duty cycle
min max min max a 29.70 30.30 1.169 1.193 b 2.30 2.70 0.091 0.106 c 2.00 2.40 0.079 0.094 d 0.90 1.10 0.035 0.043 e 9.80 10.20 0.386 0.402 f 7.30 7.70 0.287 0.303 g 19.70 20.30 0.776 0.799 h - 4.80 - 0.189 i 3.80 4.20 0.150 0.165 j 17.00 18.00 0.669 0.709 k 4.40 4.80 0.173 0.189 l 3.40 3.80 0.134 0.150 m 10.80 11.20 0.425 0.441 n 3.10 3.40 0.122 0.134 o 2.50 2.90 0.098 0.114 p 0.60 0.70 0.024 0.028 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1312003 version: h13 marking diagram ts8p01g thru ts8p07g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 0 100 200 300 400 500 600 700 800 900 1000 0.1 1 10 100 1000 junction capacitance (pf) a reverse voltage (v) fig. 5- typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1312003 version: h13 ts8p01g thru ts8p07g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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